TESMO KICKSTAND: TRULY INVISIBLE LAPTOP STAND THAT WEIGHS NOTHING AND TAKES UP ZERO SPACE

Tesmo, a company dedicated to innovation and excellence, announces the launch of its laptop stand; The Tesmo Kickstand in September. The Kickstand is an ultra-slim, portable and ergonomic laptop stand which can be used with any laptop type can be gently attached to your laptop to instantly transform it into an ergonomic and comfortable workstation wherever you are.  Speaking about the ideologies behind it,  ...

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SLIM MINI-ITX SYSTEM WITH AMD RYZEN EMBEDDED V1000 SOC

IBASE Technology Inc. (TPEx: 8050), a world leader in the manufacture of industrial motherboard and embedded solutions, today announced the launch of the CMI300-988 slim Mini-ITX system with an onboard AMD RyzenTM Embedded V1807B processor that combines the processing power of the advanced AMD “Zen” CPU and “Vega” graphics architecture in a single chip. Measuring 200 x 200 x 62mm, the CMI300-988 is designed ...

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MAKERDIARY RELEASES PITAYA GO IOT DEVELOPMENT BOARD BASED ON NORDIC’S NRF52840 SOC

Makerdiary one of the most innovative startups in the IoT devices space which are known for a series of development boards like the nRF53832-MDK V2 IoT module, and the nRF52840 MDK USB dongle, among others, recently launched a new addition to their impressive line of Nordic’s nRF528xx-series of SoCs based IoT devices, called; Pitaya Go IoT Development Board. The Pitaya Go combines the Nordic’s nRF52840 SoC  ...

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VENTANA GW5913 SINGLE BOARD COMPUTER

A miniature 35x100mm single board computer with Mini-PCIe, 802.3at GbE Ethernet, Nano-SIM and Peripheral I/O The GW5913 is a member of the Gateworks 5th generation Ventana family of single board computers targeted for small embedded applications such as IoT Gateways, Man Portable Units (MPUs), Unmanned Aerial Vehicles (UAV) equipment, digital signage, and robotics. The GW5913 features the Freescale™ i.MX6 D ...

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FUJITSU SEMICONDUCTOR RELEASES WORLD’S LARGEST DENSITY 8MBIT RERAM PRODUCT FROM SEPTEMBER

Featuring memory with the industry’s smallest read current, optimal for small wearable devices Fujitsu Semiconductor announced the release of the 8 Mbit ReRAM MB85AS8MT, which has the world’s largest density as a mass-produced ReRAM product, available from September 2019. This ReRAM product was jointly developed with Panasonic Semiconductor Solutions Co.. The MB85AS8MT is an EEPROM-compatible non-volatile m ...

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MITSUBISHI ELECTRIC TO LAUNCH MELDIR THERMAL DIODE INFRARED SENSOR

Accurately detects heat to identify types of heat sources and specific human behavior Mitsubishi Electric Corporation announced that it will launch the Mitsubishi Electric Diode InfraRed sensor (MelDIR), a thermal sensor for applications in the fields of security, heating, ventilation and air conditioning (HVAC) and smart buildings, on November 1. MelDIR accurately distinguishes between humans and other hea ...

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MICROCHIP’S SAM R30 SUB-GHZ MODULE FOR ULTRA-LOW-POWER WPAN DESIGNS

Mouser Electronics is now stocking the SAM R30 sub-GHz module from Microchip Technology. The industry’s smallest IEEE 802.15.4-compliant module, the SAM R30 combines an ultra-low-power microcontroller with a sub-GHZ radio in a 12.7 × 11 mm package, enabling long-lasting battery life in space-constrained designs like wireless-networked sensors and controls in home automation, smart city, and industrial appli ...

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AI COMPUTE ACCELERATION STARTUP BUILDS THE LARGEST CHIP EVER FOR DEEP LEARNING APPLICATIONS

To meet the ever-increasing computational demands of AI, California based AI startup, Cerebras Systems, just recently unveiled its very first announced element claimed to be the most massive AI chip ever made. With an astounding measurement of 46,225 mm2 (up to 56.7 times more than the largest graphics processing unit) and more than 1.2 trillion transistors, the Wafer-Scale Engine from Cerebras Systems is t ...

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NEW KONTRON COME-M4AL10 (E2) MODULE

The COMe-m4AL10 (E2) is ideally suited for use in industrial IoT and Industry 4.0 applications Kontron has introduced its new COMe-m4AL10 (E2) module. The module is available with either Intel Atom®, Intel® Pentium® or Intel® Celeron® processors of the latest 5th generation. With dimensions of only 84 mm x 55 mm, it is an ideal solution for space-limited applications; furthermore the E2 version is designed ...

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SAY “HELLO” THE NEW FEATHER-COMPACTIBLE ORANGECRAB BOARD

Owing to the trend that is driving the success of the Feather form factor for boards is the change in the methodology and languages in which boards are now being programmed. It is quite certain that the maker market is in its transition state and it is hard to tell what the next interesting thing disrupting the board ecosystem is, but with the availability of open-source toolchains for FPGA chips, the age o ...

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