News & Updates

HIGH DENSITY ROBUST SSD OFFERS DENSITIES UP TO 1TB IN A 16×20 MM BGA

HIGH DENSITY ROBUST SSD OFFERS DENSITIES UP TO 1TB IN A 16×20 MM BGA

2100AI/AT SSD Family – High density robust SSD offers densities up to 1TB in a 16×20 mm BGA Micron has officially launched the Micron 2100AI/AT– an industrial- and automotive-grade PCIe NVMe Industrial SSD family based on 64-layer triple-level cell (TLC) 3D NAND technology. Available in 64GB-1TB BGA and 256GB-1TB M.2 form factors, the new 2100AI/AT series is […]

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ADVANTECH RELEASES HIGH PERFORMANCE 3.5″ SBC MIO 5373 WITH 8TH GEN. INTEL® CORE™ PROCESSORS

ADVANTECH RELEASES HIGH-PERFORMANCE 3.5″ SBC MIO-5373 WITH 8TH GEN. INTEL® CORE™ PROCESSORS

Advantech, a leading global provider of IoT systems and embedded platforms, is pleased to announce the latest 3.5″ SBC MIO-5373 based on the low power 8th Gen. Intel Core SoC. Featuring compact 146 x 102 mm dimensions, the MIO-5373 design not only offers impressive I/O functionality but also provides domain-focused features like CANBus and wide-range power input. It is ideally

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DETECTOR FILTER COMBINATION SERIES PLANAR DIFFUSED SILICON PHOTODIODES

DETECTOR-FILTER COMBINATION SERIES PLANAR DIFFUSED SILICON PHOTODIODES

OSI Optoelectronics’ detector-filter combination series incorporates a filter with a photodiode to achieve a tailored spectral response in a multitude of standard and custom combinations. All detector-filter combinations can be provided with a NIST traceable calibration data specified in terms of amps/watts, amps/lumen, amps/lux, or amps. The PIN-10DF is a 1 cm2 active area, BNC package detector-filter combination

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FANLESS EMBEDDED SYSTEMS WITH AMD RYZEN V1000 R1000 SOCS

FANLESS EMBEDDED SYSTEMS WITH AMD RYZEN V1000/R1000 SOCS

IBASE Technology Inc., a world leader in the manufacture of industrial motherboards and embedded systems, has unveiled the ASB200-918 series based on the IB918 3.5-inch form factor SBC supporting AMD Ryzen SoCs (V1605B/V1202B/R1606G/R1505G). The four models in the series bring together the powerful performance of the “Zen” CPU and “Vega” GPU architectures to deliver a new class of embedded

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ELECTRONIC ASSEMBLIES WITHOUT PCBS BUT WITH LASER DIRECT STRUCTURING

ELECTRONIC ASSEMBLIES WITHOUT PCBS BUT WITH LASER DIRECT STRUCTURING

Laser direct structuring (LDS) is a special success story. For almost 20 years, it has been possible to apply electronic conductor paths directly onto plastic parts during series production. Laser Direct Structuring (LDS) – The structure of the conductor path is applied using the LDS process. LDS enables electronic assemblies to be made in flexible

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